Competitors
6 competitors
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| # | Company | Industry | Country | Market Cap | Upside | 1D | 1W | 1M | YTD | P/E | EV/EBIT | EV/EBITA | EV/EBITDA | Div. Yield | DPS | DPS Growth | EBITDA | EBITA | EBIT | EPS | ||
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X-FAB Silicon Foundries SE
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Semiconductors | Belgium | 900.71M EUR | -11.3% Price vs consensus target Price 6.90 EUR as of 2026-09-30 Target 6.12 EUR ≈ 7 estimates · as of 2026-09-30 reported as 6.95 USD, converted at the 2026-09-30 rate | +0.29% | +6.48% | +17.75% | +33.46% | 231.8 | 38.9 | 37.3 | 8.6 | — | — | — | 155.32M USD | 35.74M USD | 34.23M USD | 0.03 USD | ||
| 1 | ? Why a competitor Tower is X-FAB's closest public specialty foundry peer, directly competing in analog/mixed-signal, MEMS, power management, and RF manufacturing for automotive, industrial, and medical customers. | Semiconductors | Israel | 22.63B EUR | +37.6% Price vs consensus target Price 227.43 USD as of 2026-09-30 Target 313.00 USD 10 estimates · as of 2026-09-25 | -2.99% | +4.67% | +14.25% | +93.69% | 88.4 | 88.1 | 88.1 | 40.8 | — | — | — | 597.01M USD | 276.26M USD | 276.26M USD | 2.57 USD | ||
| 2 | ? Why a competitor GlobalFoundries competes directly with X-FAB through its specialty and mature technology platforms, including BCD power management, RF-SOI, and SiGe, targeting automotive and industrial markets. | Semiconductors and Semiconductor Equipment | United States | 23.17B EUR | +53.4% Price vs consensus target Price 47.92 USD as of 2026-09-30 Target 73.50 USD 22 estimates · as of 2026-09-25 | +0.13% | +1.85% | +9.08% | +37.23% | 37.1 | 30.8 | 26.9 | 12.5 | — | — | — | 1.98B USD | 920.00M USD | 804.00M USD | 1.29 USD | ||
| 3 | ? Why a competitor SkyWater is a pure-play US-based specialty foundry providing custom analog/mixed-signal, MEMS, and power IC fabrication services, overlapping with X-FAB's specialty and aerospace/medical foundry business. | Semiconductors and Semiconductor Equipment | United States | — | — Price vs consensus target Price 32.46 USD as of 2026-07-30 Target no estimate stored | +6.15% | +6.15% | +6.15% | +78.74% | 13.5 | — | — | — | — | — | — | 55.91M USD | 1.12M USD | 1.12M USD | 2.41 USD | ||
| 4 | ? Why a competitor Infineon competes with X-FAB by developing and manufacturing proprietary automotive, industrial, and power semiconductors (including SiC and analog/mixed-signal ICs) in-house as an IDM, competing against the fabless and system customers that rely on X-FAB's specialty foundry manufacturing services. | Semiconductors | Germany | 77.14B EUR | +51.3% Price vs consensus target Price 59.50 EUR as of 2026-09-30 Target 90.00 EUR 23 estimates · as of 2026-09-30 | +0.34% | +5.76% | +7.13% | +57.70% | 64.9 | 32.5 | 28.1 | 19.7 | 0.59% | 0.35 EUR | 0.0% | 4.19B EUR | 2.94B EUR | 2.55B EUR | 0.92 EUR | ||
| 5 | ? Why a competitor STMicroelectronics competes with X-FAB by manufacturing and supplying competing analog/mixed-signal, MEMS, and Silicon Carbide (SiC) power semiconductors for overlapping automotive and industrial end markets, offering in-house IDM solutions alongside foundry and ASIC alternatives. | Semiconductors | Netherlands | 41.82B EUR | +45.5% Price vs consensus target Price 46.88 EUR as of 2026-09-30 Target 68.20 EUR ≈ 19 estimates · as of 2026-09-29 reported as 77.42 USD, converted at the 2026-09-30 rate | -0.34% | +4.46% | +10.83% | +108.91% | 101.7 | 52.5 | 46.5 | 16.5 | 0.68% | 0.36 USD | 0.0% | 2.79B USD | 991.00M USD | 878.00M USD | 0.52 USD | ||
| 6 | ? Why a competitor ams-OSRAM is a competitor through its Full-Service Foundry and ASIC business, directly competing with X-FAB in specialty contract manufacturing of analog/mixed-signal, CMOS, and sensor ICs for automotive, industrial, and medical customers. | Semiconductors | Austria | 2.27B EUR | -11.9% Price vs consensus target Price 21.56 CHF as of 2026-09-30 Target 18.99 CHF ≈ 9 estimates · as of 2026-09-29 reported as 20.07 EUR, converted at the 2026-09-30 rate | -2.18% | +4.05% | +23.48% | +174.65% | — | 30.1 | 18.5 | 7.6 | — | — | — | 477.00M EUR | 197.00M EUR | 121.00M EUR | -3.28 EUR |
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Competitors
28 events
Infineon Technologies AG Presents at AI & Technology Virtual Investor Conference, Oct-01-2026 10:30 AM. Speakers: Daniel Györy, Senior Director Investor Relations.
Company Conference Presentations · Company Website, GlobeNewswire
Infineon Technologies AG Presents at Data Centre World Asia, Sep-29-2026 . Venue: Marina Bay Sands Expo & Convention Centre, Basement 2, Hall E, Booth M15, Singapore, Singapore.
Company Conference Presentations · Company Website
DG Matrix utilized ST’s silicon carbide (SiC) technology at the heart of Interport multi-port solid-state transformer platform. The use of ST’s SiC technology has contributed to a significant performance breakthrough: doubling the Interport’s output from 200 kW to 400 kW within essentially the same power module footprint. The same principles that enabled this breakthrough, delivering more power without increasing power module space requirements, are increasingly critical to supporting the growth of large-scale AI datacenters. The performance leap comes from the use of silicon carbide technology, which enables significant performance improvements and efficiency above 98.5%. These are the same advanced SiC components ST supplies for leading electric vehicle powertrain applications, among the most demanding power electronics environments. The field experience gained through automotive applications provides DG Matrix and its datacenter and electrification customers with additional confidence in the performance and reliability of the underlying SiC technology. ST has supported DG Matrix’s ongoing product development efforts by providing access to advanced SiC technologies and technical expertise. The collaboration extends beyond component supply. ST has provided DG Matrix with technical support and insights into relevant technology developments to help optimize the use of SiC devices within the Interport™ platform. DG Matrix’s application experience provides insights into system-level requirements, including voltage, current, and thermal performance considerations for future generations of power devices. ST’s advanced SiC devices have strong surge current handling capabilities. This feature is important for datacenter applications. AI workload transients are placing increasingly stringent demands on power electronics systems. ST’s technology integrates with DG Matrix’s growing Interport product family. This integration supports the development of scalable and resilient power infrastructure. It benefits AI datacenters, utility microgrids, and electrification applications.
Client Announcements · Business Wire
ams OSRAM unveiled key photonic building blocks required for next-generation AI infrastructure. These include addressable micro-emitter arrays based on both LED and VCSEL technologies, as well as matching micro-photodiode arrays that together form the optical foundation of future ultra-high-bandwidth interconnect architectures. At ECOC 2026 in Malaga, ams OSRAM will unveil its latest breakthrough in Thin-Film VCSEL technology and demonstrate a connectorized multi-core fiber solution in collaboration with BizLink, maturing the ecosystem for highly parallel, ultra-low-power optical interconnects for AI Scale-up. ams OSRAM continues to expand its photonics portfolio through the development of a next-generation 850 nm Thin-Film VCSEL platform specifically designed for AI scale-up interconnects. The platform combines several differentiating technologies in a single architecture, including top-emission Thin-Film VCSELs, dense 25 µm pitch microVCSEL arrays with addressability, silicon TSV integration and compatibility with standard multimode fiber infrastructure. This enables highly parallel optical links with exceptional packaging density and ultra-low-power operation. The company has successfully completed microVCSEL integration on silicon TSV substrates and demonstrated error-free 32 Gb/s NRZ operation. The platform achieves an energy efficiency of approximately 0.25 pJ/bit while maintaining compatibility with scalable manufacturing approaches. This level of efficiency highlights the potential of highly parallel optical architectures to support future bandwidth scaling while minimizing power consumption.
In addition, reliability testing has shown no failures after more than 2,000 hours under elevated junction temperatures and current overstress conditions.
Building on these results, ams OSRAM is advancing the development of fully integrated 3D photonics stacks combining microVCSEL arrays, micro-photodiode arrays and mixed signal CMOS electronics for future ultra-high-bandwidth optical interconnect architectures.
The demonstrator combines ams OSRAM’s 2D addressable 850 nm microVCSEL array technology with BizLink’s fiber-array integration and optical connectivity expertise, creating a connectorized multi-core fiber solution optimized for wide-and-slow data communication.
The system will be demonstrated in a private setting for selected customers and industry partners during the event.
Product-Related Announcements · DGAP - Germany
Tower Semiconductor Ltd. Presents at European Conference on Optical Communication 2026 (ECOC 2026), Sep-21-2026 . Venue: Booth 1436, FYCMA, Málaga, Spain.
Company Conference Presentations · Company Website, GlobeNewswire
Tower Semiconductor Ltd added to PHLX Semiconductor Sector Index
Index Constituent Adds · Index Website
Tower Semiconductor Ltd. and NewPhotonics announced high-volume shipment of laser-integrated serviceable optical engines designed to meet the urgent and growing demand for high-bandwidth, energy-efficient optical interconnects in artificial intelligence infrastructure. The PIC optical engine chips support OEM solutions ranging from FRO/LRO/LPO and Extra-Dense Packaged Optics (XPO) pluggable transceiver modules and Near-Packaged Optics (NPO) socket pluggable applications. Shipping volume production PICs support data rates from 800G to 1.6T, with future volume manufacturing planned at 6.4T NPO solutions suitable for scale-out and scale-up architectures. The collaboration leverages the high-volume PH18DA silicon photonics (SiPho) technology platform featuring heterogeneously integrated InP components enabling monolithic integration of lasers, semiconductor optical amplifiers (SOAs), modulators, and photodetectors on a single photonic integrated circuit. Volume shipment of NewPhotonics NPG102 PIC products for 800G and 1.6T feature 200G-per-lane designs and heterogeneously integrated lasers on a monolithic PIC enable customers to leverage optical signal processing in a unified architecture that delivers power efficiency, bandwidth density, and manufacturing consistency. The CPX-MSA compliant NPC505 chipsets for 6.4T will begin volume shipment in First Half 2027. Both companies will participate in the upcoming ECOC 2026, September 21-23 at FYCMA in Malaga, Spain, with representatives available for meetings during the event.
Strategic Alliances · SEC Form 6k
Infineon Technologies AG Presents at J.P. Morgan Milan Access Day, Sep-17-2026 08:00 AM. Venue: Mian, Italy.
Company Conference Presentations · Company Website
Infineon Technologies AG Presents at BNP Paribas ESG Conference, Sep-16-2026 . Venue: Paris, France.
Company Conference Presentations · Company Website
Tower Semiconductor announced its participation in upcoming ECOC 2026, taking place September 21–23, 2026 at FYCMA, Malaga, Spain, booth #C1014. During the event days, company representatives will be available for meetings to discuss current and future silicon photonics roadmap. Tower will showcase its high-volume and high-performance Silicon Photonics platform, widely utilized across the industry for datacenter and telecom optical transceivers, as well as for high-growth applications, including near- and co-packaged optics (NPO/CPO) for next-generation AI cluster architectures, DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI, and quantum computing. The company will also feature its Silicon Germanium (SiGe) BiCMOS solutions, which complement its SiPho platform to address the higher-bandwidth, lower-latency and lower-power demands of next-generation AI infrastructure.
Product-Related Announcements · GlobeNewswire
STMicroelectronics introduced ST SafeSense VD56GA, a new 1.1 MP automotive image sensor for infrared in-cabin sensing that helps OEMs and Tier 1 suppliers scale driver and occupant monitoring across vehicle lines while balancing performance, integration, and cost. VD56GA meets that need with a compact sensor architecture, high infrared sensitivity, and embedded image-processing features that can help simplify camera design and integration. The sensor is designed to give camera developers the image quality needed for driver and occupant monitoring while preserving the size and cost advantages of a compact format. VD56GA is designed to help reduce the cost of the complete camera module. Its imaging performance enables the use of lower-cost optics, simplified infrared illumination, less demanding optical filtering, and no external image-processing. The sensor leverages a new backside-illuminated pixel architecture, called ST DeepNIR, optimized for infrared imaging. With 35% higher modulation transfer function (MTF) sharpness and nearly 60% higher quantum efficiency than the previous generation, VD56GA is currently the only sensor in its class to achieve this level of combined optical resolution and infrared sensitivity, helping in challenging conditions like under display camera. By extracting more performance from a compact 1.1 MP architecture, VD56GA helps automotive designers achieve the image quality required for advanced sensing functions, while benefiting from the integration and cost advantages of a compact sensor architecture. Designed for modern automotive camera modules, VD56GA is housed in a compact 3.7 mm x 3.2 mm CSP package, making it suitable for space-constrained installations and next-generation in-cabin camera designs. The device also integrates a range of embedded image-processing functions, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing. These features remove the need for external image-processing resources, simplify camera design and speed development. Support for both RAW and YUV output formats give OEMs and Tier 1 suppliers flexibility across different electronic architectures and software environments, making it easier to adapt the device to a broad range of implementation strategies. VD56GA builds on ST’s established presence in automotive imaging and in-cabin sensing. Earlier this year, ST announced shipment of its 10 millionth automotive of SafeSense by ST image sensors, reflecting broad adoption across key automotive regions, including Europe, Asia, and the United States. Customers benefit from ST’s vertically integrated manufacturing model and secure supply chain, with front-end manufacturing of VD56GA takes place at ST’s facility in Crolles, France and packaging in Asia; reinforcing the company’s focus on industrial resilience, product quality, and supply continuity for automotive customers worldwide. Samples are available now. Pricing information and sample requests are available from local ST sales offices.
Product-Related Announcements · GlobeNewswire
GLOBALFOUNDRIES Inc. has filed a Shelf Registration in the amount of $465.152383 million.
Security Name: Ordinary Shares
Securities Offered: 9,907,399
Shelf Registration Filings · Capital IQ Transaction Database
GLOBALFOUNDRIES Inc. has filed a Shelf Registration in the amount of $921.589391 million.
Security Name: Ordinary Shares
Securities Offered: 19,629,167
Transaction Features: ESOP Related Offering
Shelf Registration Filings · Capital IQ Transaction Database
Tower Semiconductor Ltd. Presents at Benchmark-StoneX 13th Annual Tech, Media and Telecom Conference, Sep-10-2026 . Venue: New York Athletic Club, New York, New York, United States.
Company Conference Presentations · Company Website, GlobeNewswire
Infineon Technologies AG Presents at Citi’s 2026 Global TMT Conference, Sep-10-2026 . Venue: New York Hilton Midtown, New York, New York, United States.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire, PR Newswire, SEDAR
STMicroelectronics N.V. Presents at Citi’s 2026 Global TMT Conference, Sep-09-2026 10:50 AM. Venue: New York Hilton Midtown, New York, New York, United States. Speakers: Lorenzo Grandi, President & CFO.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire, PR Newswire, SEDAR
SolarEdge Technologies, Inc. announced an extension of its collaboration with Infineon Technologies AG to advance solid-state circuit breaker (SSCB) technology for high-voltage DC distribution in AI and hyperscale data centers. The collaboration addresses a key challenge in the adoption of 800 VDC architecture: Safe operation of increasingly power-dense infrastructure requires a very fast fault-isolation to achieve selectivity while maintaining high efficiency. Extending the collaboration to solid-state protection addresses a critical gap in the distribution layer between the solid-state transformer (SST) and the compute rack, advancing a comprehensive grid-to-rack solution. SolarEdge is leading the design of its SSCB solution, with Infineon providing its silicon carbide (SiC) JFET technology at the core of the protection devices. SSCBs are designed to interrupt faults within a few microseconds, with no mechanical contacts to separate, while Infineon's CoolSiC JFET devices deliver efficient operation and superior robustness. The collaboration builds directly on SolarEdge's SST platform with Infineon SiC components, first announced in November 2025. The SST is designed to enable direct medium-voltage (13,800-34,500 V) to 800-1,500 VDC conversion at over 99% efficiency, collapsing multiple conversion stages into a single solution while reducing physical footprint. Building on more than 20 years of leadership in DC-coupled power electronics, SolarEdge is developing an 800 VDC powertrain for AI factories, a DC-native chain that carries power from the medium-voltage grid connection through conversion, distribution and protection to the compute rack. Infineon's broad portfolio of silicon, silicon carbide and gallium nitride solutions provides that foundation, supporting the decarbonization of AI infrastructure through lower losses, reduced environmental impact, and improved total cost of ownership.
Client Announcements · Business Wire
GLOBALFOUNDRIES Inc. Presents at Goldman Sachs Communacopia + Technology Conference 2026, Sep-08-2026 02:25 PM. Venue: The Palace Hotel, California, United States.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire, Other, PR Newswire, SEDAR
GlobalFoundries announced it has finalized a definitive agreement with the U.S. Department of Commerce's CHIPS Research and Development Office for a USD 375 million award for research and development to accelerate the company's Quantum Technology Solutions business, designed to help scale domestic quantum semiconductor manufacturing and strengthen the United States' leadership in quantum technologies. The agreement advances the goal of establishing a secure, U.S.-based ecosystem for the development and manufacturing of quantum chips. Through Quantum Technology Solutions, GlobalFoundries is accelerating R&D and expanding access to advanced manufacturing capabilities and enabling quantum computing companies to move from research and prototyping toward commercial-scale production. Under the agreement, GlobalFoundries is eligible to receive up to USD 375 million in funding over a five-year period tied to the achievement of specified milestones. GlobalFoundries has continued to advance its quantum technology roadmap and deepen collaborations across the quantum ecosystem. The company's efforts are focused on enabling the transition from research-driven innovation to scalable manufacturing through differentiated capabilities in cryogenic CMOS technologies, advanced packaging and heterogeneous integration, helping position GlobalFoundries as a foundry partner of choice for emerging quantum applications. The completion of the agreement reflects continued progress toward establishing a robust U.S. quantum supply chain and expands GlobalFoundries' broader efforts to advance critical semiconductor technologies. GlobalFoundries has also recently announced it has entered into a USD 300 million letter of intent with the Department's CHIPS Research and Development Office to accelerate R&D in silicon photonics. GlobalFoundries' initiatives in quantum computing and next-generation optical connectivity are two technologies expected to be foundational to future AI infrastructure and advanced computing systems. GlobalFoundries is focused on continuing to strengthen its position as a trusted manufacturing partner for emerging technology innovators through investments in research.
Regulatory Authority – Compliance · Other
SkyWater Technology announced that it has entered into a multi-year commercial collaboration with Qolab. The agreement is designed to transition superconducting technology from custom development programs to repeatable wafer manufacturing. The engagement combines platform-based wafer services, defined production terms, and coordinated capacity planning. The framework provides Qolab with greater visibility as it scales and creates a commercial model that drives broader adoption of SkyWater’s superconducting technologies. SkyWater is investing in dedicated quantum tool upgrades as part of a broader modernization of its fabrication facilities to accelerate this transition. As quantum technologies advance, companies need access to specialized fabrication capabilities within a disciplined commercial foundry environment. Both companies believe this first-of-its-kind collaboration establishes an open-access, and capital-efficient model. This partnership connects quantum technology development with repeatable wafer manufacturing. The collaboration also provides greater consistency and commercial visibility. Under the agreement, Qolab will serve as a lead customer on SkyWater’s newly launched SC250 superconducting platform to advance its Quantum System-in-Package (QSiP). The QSiP architecture is designed to address key cost, complexity, and form-factor challenges in scaling quantum systems. It achieves this by integrating cryogenic wiring, low-pass filters, and amplifiers into a compact package. The collaboration links SkyWater’s superconducting platform with Qolab’s back-end packaging, integration, and testing capabilities in Wisconsin. Together they establish a coordinated Midwest manufacturing pathway for superconducting quantum devices. Key Commercial & Financial Highlights: Unprecedented Commercial Framework: A first-of-its-kind agreement combining custom technology development transitioning to locked-in unit production costs at high volumes. Strategic Infrastructure Investment: SkyWater is investing in superconducting fabrication tool upgrades. This reinforces its broader fab-wide modernization initiative, and its long-standing heritage of developing unique process capabilities. Accelerated SC250 Platform Utilization: Qolab's adoption of SC250 validates SkyWater's TaaS model and creates a blueprint for other quantum hardware developers. This repeatable blueprint will accelerate the transition from custom fabs to foundries. Unique Midwest Superconducting Manufacturing Partnership: Linking SkyWater’s specialized fabrication capabilities in Minnesota with Qolab’s design and testing expertise in Wisconsin is unique. This collaboration establishes a first-of-its-kind regional ecosystem to accelerate workforce development.
Client Announcements · Business Wire
GlobalFoundries announced it has finalized a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office for a $375 million award for research and development to accelerate the company's Quantum Technology Solutions business, designed to help scale domestic quantum semiconductor manufacturing and strengthen the United States' leadership in quantum technologies. The agreement advances the goal of establishing a secure, U.S.-based ecosystem for the development and manufacturing of quantum chips. Through Quantum Technology Solutions, GlobalFoundries is accelerating R&D and expanding access to advanced manufacturing capabilities and enabling quantum computing companies to move from research and prototyping toward commercial-scale production. Under the agreement, GlobalFoundries is eligible to receive up to $375 million in funding over a five-year period tied to the achievement of specified milestones. The completion of the agreement reflects continued progress toward establishing a robust U.S. quantum supply chain and expands GlobalFoundries' broader efforts to advance critical semiconductor technologies.
Regulatory Authority – Compliance · GlobeNewswire
SkyWater Technology, Inc. announced the launch of SkyWater Quantum Solutions, a dedicated merchant supplier offering focused on semiconductor process development, integration, and manufacturing. This unique offering will provide semiconductor solutions for quantum-computing, networking, and sensing applications. SkyWater Quantum Solutions brings together SkyWater’s semiconductor process development and manufacturing capabilities via their proven Technology as a Service model. Those capabilities specialize in superconducting and quantum photonics technologies, heterogeneous integration, and advanced packaging. The offerings are intended to help customers accelerate their time to market. This is achieved by incorporating manufacturing requirements earlier in the development of quantum devices and systems. SkyWater Quantum Solutions will provide quantum-focused process development, device integration, characterization, and manufacturing support. SkyWater engineers will work with customer teams on materials, process modules, device structures, and integration requirements. The integrated approach ensures process control and repeatability. Initial offerings include SC250, a superconducting technology platform, focused on high-density cryogenic interconnect and control; and SP90, a low-loss silicon-nitride photonics technology platform for quantum applications. The platforms can be combined with SkyWater’s heterogeneous-integration and advanced-packaging capabilities to incorporate additional materials, active devices, and optical interfaces. Development programs may range from individual process modules to customized engagements involving process integration, characterization, and manufacturing support. This enables the customized capabilities quantum technologies need in a mature, trusted foundry environment. SkyWater Quantum Solutions combines relevant Nexus capabilities with its SP90 platform and other quantum-critical materials, such as diamond and lithium niobate. The resulting development work will focus on integrated photonic devices for scalable routing, control, and processing in quantum optical systems. Supported systems include photonic, trapped ion, and neutral atom quantum computers, quantum networks, and quantum sensors.
Product-Related Announcements · Business Wire
Infineon Technologies AG Presents at Goldman Sachs Communacopia + Technology Conference 2026, Sep-08-2026 . Venue: The Palace Hotel, California, United States.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire, Other, PR Newswire, SEDAR
Sirin Software announced that it has joined the Infineon Technologies partner ecosystem as an INFINEON Associated Partner. The partnership expands Sirin Software's support for companies developing connected, secure, and AI-ready products based on Infineon technologies, including PSOC microcontrollers, XMC industrial MCUs, AIROC Wi-Fi and Bluetooth solutions, OPTIGA Trust M security, and ModusToolbox. Sirin Software brings hands-on engineering experience across PSOC 4, PSOC 6, PSOC Edge, XMC1000/4000/7000, AIROC wireless devices, and OPTIGA Trust M. Its capabilities include embedded firmware and application development, board bring-up, BSPs, bootloaders, device drivers, RTOS integration, wireless connectivity, secure OTA updates, low-power optimization, hardware-software integration, device security, and Edge AI. The company also works natively with ModusToolbox, AIROC Bluetooth SDK, Wi-Fi Host Driver (WHD), Zephyr RTOS, and PSOC Creator. For companies maintaining legacy Cypress and Infineon products, Sirin Software provides WICED IoT Platform to ModusToolbox migration, helping preserve validated application logic while moving to supported tooling and newer AIROC technologies. For wireless applications, Sirin Software supports AIROC Wi-Fi and Bluetooth integration, including devices such as CYW43012 and CYW55513, covering low-power endpoints through Wi-Fi 6/6E connected products. For Edge AI applications, Sirin Software supports PSOC Edge E81/E82/E83/E84 platforms and technologies including Arm Ethos-U55 and Infineon NNLite for always-on sensing and on-device machine learning. Sirin Software also supports XMC industrial MCU development for applications including motor control, digital power conversion, industrial I/O, machine monitoring, CAN FD, and Ethernet-connected systems. Since 2014, Sirin Software has delivered 100+ hardware and software products for 50+ clients worldwide.
Client Announcements · PR Newswire
GlobalFoundries announced process design kit (PDK) availability for its UX platform family, two new feature-rich CMOS technologies purpose-built for next-generation intelligent edge devices and advanced sensing systems. The UX family includes 40nm (40UX) and 22nm (22UX) technologies, providing customers with a scalable roadmap for ultra-low power microcontrollers, wireless connectivity devices, sensor interfaces, imaging systems and edge AI applications. Built on proven technology modules and supported by GF’s design ecosystem and global manufacturing footprint, UX technologies help customers accelerate development of AI devices and intelligent systems while balancing performance, power, cost and supply requirements. The UX family expands GF’s portfolio of differentiated technologies for Physical AI, giving customers a scalable path for solutions enabling connected microcontrollers (MCUs), highly integrated sensing and mixed-signal systems. 40UX brings proven, cost-efficient integration to MCUs and always-on-edge devices, while 22UX provides a higher level of analog, sensing, and mixed-signal performance for more complex intelligent systems. The 40UX platform is optimized for secure, smart and connected microcontrollers and systems-on-a-chip (SoCs) serving wearable, IoT and wireless connectivity applications. Based on GF’s high-volume 40nm platform with high-endurance eFlash technology that has shipped more than one million wafers to date, 40UX combines ultra-low leakage transistors and SRAM, low-noise analog capabilities, integrated embedded flash with built-in self-test functionality and advanced RF enablement to support long battery life, high reliability and compact form factors. The platform is particularly well suited for Bluetooth Low Energy (BLE) devices, wireless connectivity products, low-noise sensor interfaces and other power-sensitive edge applications. The 40UX platform is set to ramp to volume production at GF’s Singapore site by 2027, with future production planned through its site in Malta, New York. The technology’s roadmap includes optimizations embedded processing, including high-voltage and noise enablement, Automotive Grade 1 qualification and enhanced embedded non-volatile memory options. For applications that require higher levels of analog integration and sensing performance, the 22UX platform delivers an analog-optimized 22nm solution for edge AI, imaging and mixed-signal systems. The platform combines ultra-low power operation with low-noise analog devices, improved device matching, wafer-scale Random Telegraph Signal (RTS) noise characterization, bonding-ready wafers for advanced 3D integration and a roadmap for ultra-low leakage, analog compute-in-memory and embedded memory capabilities. The platform is ideally suited for stacked CMOS image sensor readout ICs with a 1/f flicker noise and low-noise 3.3V analog FET for precise measurement. The platform’s improved device matching and higher voltage headroom make it an optimal choice for cost-optimized mixed-signal SoCs, sensor interfaces and power sensitive edge devices that require superior analog performance. The 22UX platform integrates analog-optimized features including ultra-low power capabilities for exceptional energy-efficiency and third generation fill cells for faster product-level block/module integration. The platform is industry-compatible, offering easy porting from other bulk CMOS platforms, and was developed using high-volume proven modules and GF’s successful 28nm technology that has shipped over one million wafers to date. 22UX will be manufactured at GF’s advanced manufacturing facility in Dresden, Germany with a roadmap to reach multi-site production through GF’s global footprint. Both platforms are available for customer engagement and prototyping through GF’s GlobalShuttle multi-project wafer program with quarterly shuttles scheduled through 2027.
Product-Related Announcements · GlobeNewswire
GlobalFoundries Inc. and RAAAM Memory Technologies announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) technology. The partnership has reached a major milestone with the successful tape-out of a GCRAM test vehicle on GlobalFoundries Inc.'s FDX FD-SOI platform. Leveraging RAAAM Memory Technologies' patented GCRAM, the companies have co-designed the GCRAM bitcell using pushed design rules on FDX technology, achieving 40% memory area shrink and up to 60% memory power reduction compared to SRAM. The companies have jointly designed and taped out a GCRAM test chip. At the next step, the companies will start providing GCRAM design access to lead customers in early 2027. NXP Semiconductors is closely evaluating the benefits of the GCRAM solution.
Strategic Alliances · GlobeNewswire
Infineon Technologies AG Presents at DbAccess European TMT Conference 2026, Sep-02-2026 07:00 AM. Venue: Deutsche Bank, 21 Moorfields, London, United Kingdom.
Company Conference Presentations · Company Website, Regulatory News Service
Navitas Semiconductor Corporation announced that the first shipments of U.S.-manufactured 5th Generation GaNFast technology, in partnership with GlobalFoundries Inc., will begin in September, marking a major milestone in strengthening the domestic GaN ecosystem for AI infrastructure and critical national security applications. In November 2025, Navitas Semiconductor Corporation and GlobalFoundries Inc. announced a long-term strategic partnership to accelerate U.S. GaN innovation and domestic manufacturing. Navitas Semiconductor Corporation developed its Gen 5 GaNFast FETs and power integrated circuits (ICs) for production at GlobalFoundries Inc.'s US based 200mm GaN-on-Si manufacturing facility in Burlington, Vermont. The first shipment of the Gen 5 GaNFast family marks a major milestone in the Navitas Semiconductor Corporation-GlobalFoundries Inc. collaboration, bringing Navitas Semiconductor Corporation’s next-generation GaNFast technology into a U.S. production foundry for AI infrastructure, performance computing, industrial electrification, and critical national security applications. Working closely with GlobalFoundries Inc., Navitas Semiconductor Corporation applied this expertise to optimize its proprietary Gen 5 GaNFast technology and device architectures for manufacturing on GlobalFoundries Inc.'s advanced 200 mm GaN-on-silicon platform. Combined with GlobalFoundries Inc.'s decades of semiconductor manufacturing expertise and high-volume production capabilities, the partnership delivers a trusted U.S.-based supply of advanced GaN power semiconductors for AI infrastructure and other critical applications. The initial product family is expected to include 650 V GaN FETs with RDS(ON) values of 11mO, 18mO, 50mO, 120mO, and 150mO, with first wafers scheduled to ship in September, internal samples in October, and strategic customer samples before the end of the year.
Strategic Alliances · GlobeNewswire
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