Competitors
5 competitors
· 3 industries
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| # | Company | Industry | Country | Market Cap | Upside | 1D | 1W | 1M | YTD | P/E | EV/EBIT | EV/EBITA | EV/EBITDA | Div. Yield | DPS | DPS Growth | EBITDA | EBITA | EBIT | EPS | ||
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ASML Holding N.V.
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Semiconductor Materials and Equipment | Netherlands | 613.25B EUR | +31.5% Price vs consensus target Price 1596.80 EUR as of 2026-09-30 Target 2100.00 EUR 32 estimates · as of 2026-09-29 | -0.27% | +6.23% | +11.24% | +73.30% | 57.9 | 48.6 | 48.4 | 45.1 | 0.47% | 7.50 EUR | +17.2% | 13.49B EUR | 12.56B EUR | 12.51B EUR | 27.57 EUR | ||
| 1 | ? Why a competitor Nikon is a primary direct competitor in semiconductor lithography, offering DUV (deep ultraviolet) immersion and dry lithography systems that compete directly for global chipmaker accounts. | Semiconductors and Semiconductor Equipment | United States | 724.99M EUR | +52.2% Price vs consensus target Price 4.60 USD as of 2026-09-30 Target 7.00 USD 7 estimates · as of 2026-09-25 | -3.16% | -5.54% | +9.26% | +96.58% | 105.1 | — | — | — | — | — | — | -14.26M USD | -15.08M USD | -15.08M USD | 0.04 USD | ||
| 2 | ? Why a competitor Canon competes directly in lithography systems, producing i-line, KrF DUV, and nanoimprint lithography (NIL) equipment targeting semiconductor manufacturers for mature and advanced packaging nodes. | Technology Hardware, Storage and Peripherals | Japan | 21.91B EUR | +2.1% Price vs consensus target Price 4605.00 JPY as of 2026-09-30 Target 4700.00 JPY 11 estimates · as of 2026-09-24 | +0.39% | +0.90% | -3.05% | -0.60% | 11.6 | 9.6 | 8.5 | 6.4 | 3.47% | 160.00 JPY | +3.2% | 726.25B JPY | 544.55B JPY | 481.72B JPY | 396.44 JPY | ||
| 3 | ? Why a competitor KLA directly rivals ASML's Applications business (YieldStar / HMI) in optical and electron-beam wafer metrology, inspection, and yield-management solutions for identical semiconductor fab customers. | Semiconductor Materials and Equipment | United States | 224.23B EUR | +20.0% Price vs consensus target Price 194.93 USD as of 2026-09-30 Target 234.00 USD 26 estimates · as of 2026-09-25 | -0.81% | +4.18% | +14.07% | +60.42% | 52.9 | 45.2 | 43.7 | 42.3 | 0.41% | 0.80 USD | +18.5% | 6.05B USD | 5.85B USD | 5.66B USD | 3.68 USD | ||
| 4 | ? Why a competitor Applied Materials competes with ASML's computational and e-beam metrology/patterning portfolio while offering alternative patterning solutions and broad semiconductor manufacturing equipment. | Semiconductor Materials and Equipment | United States | 357.46B EUR | +27.1% Price vs consensus target Price 511.38 USD as of 2026-09-30 Target 650.00 USD 36 estimates · as of 2026-09-27 | -0.12% | +7.83% | +15.74% | +98.99% | 43.8 | 42.0 | 42.0 | 39.8 | 0.35% | 1.78 USD | +17.1% | 10.16B USD | 9.63B USD | 9.63B USD | 11.67 USD | ||
| 5 | ? Why a competitor Lasertec supplies essential EUV mask inspection and metrology systems used alongside ASML's EUV scanners, competing for patterning control and defect inspection budgets in advanced semiconductor fabs. | Semiconductor Materials and Equipment | Japan | 20.65B EUR | +18.9% Price vs consensus target Price 41130.00 JPY as of 2026-09-30 Target 48900.00 JPY 16 estimates · as of 2026-09-25 | +0.32% | +3.39% | +24.33% | +38.74% | 47.7 | 34.2 | 34.2 | 32.7 | 0.80% | 329.00 JPY | 0.0% | 109.93B JPY | 105.26B JPY | 105.26B JPY | 862.98 JPY |
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Recent key developments
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6 events
Xanadu Quantum Technologies Limited announced a collaboration to develop advanced lithography processes for Xanadu’s photonic quantum hardware with ASML. This collaboration aims to enable both companies to gain deeper insight into how advanced lithography innovations can help reduce optical losses in quantum computing chips, accelerating the industry's path toward utility-scale quantum computing (USQC). For photonic quantum hardware, reducing optical loss is an important technical challenge on the path toward fault-tolerant operation and error correction. Optical loss in photonic quantum processors can be influenced by line edge roughness (LER), which is affected by lithography and related process conditions. Through this collaboration, Xanadu and ASML will explore lithography-enabled process approaches that may contribute to improved patterning control and lower-loss photonic structures. This collaboration with ASML reflects Xanadu’s continued focus on advancing photonic quantum hardware and further solidifies Xanadu's leading position within the semiconductor and quantum computing ecosystem. This work paves the way toward future manufacturing and commercialization and marks another significant step in the company’s mission to build quantum computers that are useful and available to people everywhere.
Strategic Alliances · GlobeNewswire – Canada
Samsung Electronics Co., Ltd. announced an expansion of their long-standing strategic partnership with ASML Holding N.V., deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next generation of innovation in the AI era. Building on years of successful cooperation, the companies will work together to accelerate the development and deployment of technologies that support the increasing performance and efficiency requirements of advanced semiconductor manufacturing. Samsung Electronics Co., Ltd. will join the industry initiative to advance next-generation 12-inch photomask technology for future manufacturing. With High NA EUV, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints. It will enable advanced chip manufacturers to fully leverage the advantages of High NA EUV, making future generations of leading-edge chips more cost-effective. Drawing on its leadership in both memory and foundry manufacturing, as well as its extensive experience with advanced EUV lithography, Samsung Electronics Co., Ltd. is positioned to play a critical role in the 12-inch photomask transition. The company will work closely with industry partners to develop the required mask technologies and supporting infrastructure. Samsung Electronics Co., Ltd. also plans to introduce ASML Holding N.V.’s High NA extreme ultraviolet (EUV) lithography into future DRAM high-volume manufacturing for the first time in the industry by 2028, further demonstrating the readiness of High NA technology to support advanced memory and logic applications. High NA EUV is expected to extend the DRAM scaling roadmap, with improved resolution enabling process simplification and increased efficiency. The announcement reflects a shared commitment to innovation, technology leadership and long-term partnership. Samsung Electronics Co., Ltd. and ASML Holding N.V. expect to continue exploring opportunities for collaboration in areas including advanced memory and innovative manufacturing approaches.
Strategic Alliances · Business Wire
ASML Holding N.V. marked the start of construction of its second major industrial campus in the Brainport region, the Netherlands. The company celebrated the milestone with a groundbreaking ceremony at Brainport Industries Campus (BIC) North, launching a multi-phase development project that will eventually span approximately 350,000 square meters and provide potential capacity for up to 20,000 workplaces. The new location ensures that key activities remain closely connected within the region and are an integral part of the company’s global network. The first phase of BIC North, expected to be completed in 2029, will house at least 3,000 employees, bringing together production, logistics and supporting office activities in one integrated industrial campus. These workplaces are primarily intended for teams relocating from existing ASML locations. A key element of the campus will be ASML’s new flow factory, ASML’s next-generation innovative manufacturing operating model for the TWINSCAN factory. This model is designed to enable faster, more efficient and higher-scale module production and installation. It streamlines the flow of materials and work through the factory, helping improve productivity while maintaining high-quality standards. In the long term, the BIC campus could accommodate up to 20,000 workplaces, depending on future requirements, providing the flexibility needed to support industry growth. ASML’s future footprint in the Brainport region will comprise three complementary campuses: a dedicated headquarters campus (De Run 1000) and an industrial campus (De Run 6000/7000) in Veldhoven, alongside the company’s second industrial campus at BIC North in Eindhoven. Together, these locations will support ASML’s innovation, manufacturing and corporate activities in the region. The development of BIC North reflects the close collaboration between ASML, governments, knowledge institutions and many other stakeholders. Through public-private partnerships, ASML and its partners continue to invest in long-term priorities such as talent development, affordable housing and equal opportunity, helping to support sustainable growth for both the company and the Brainport region.
Business Expansions · GlobeNewswire
Taiwan Semiconductor Manufacturing Company and ASML Holding N.V. announced a collaborative initiative to lead the semiconductor industry’s transition to a larger-format Extreme Ultraviolet (EUV) lithography photomask. On September 7, in advance of the SPIE Bacus Conference, ASML and TSMC formed a collaborative industry initiative to drive the transition to 12-inch photomasks, maximizing the value of High NA EUV lithography. The initiative targets establishing a 12-inch mask pilot line by 2031, supporting full lithography system readiness for advanced node production by 2033. While High NA EUV will be adopted for production using the current, 6-inch masks, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints, benefiting the entire semiconductor industry. It will enable advanced chip manufacturers to fully leverage the advantages of High NA EUV, making future generations of leading-edge chips more cost-effective. TSMC intends to use ASML’s High NA technology in high-volume manufacturing for advanced nodes starting in 2030. As technology nodes advance, TSMC expects the number of layers requiring High NA EUV will rise, driven primarily by the increasingly complex transistor architectures required for AI applications. On September 7, in advance of the annual SPIE BACUS Conference in Monterey, California, ASML and TSMC established an industry-wide collaborative initiative to drive the transition to 12-inch photomasks. This effort aims to establish a 12-inch mask pilot line by 2031, paving the way for 12-inch High-NA lithography systems to enter advanced node production by 2033. Underscoring broad industry support, major ecosystem partners and suppliers attended the event and expressed their interest in this transition.
Strategic Alliances · GlobeNewswire
Intel Foundry and ASML highlighted continued progress in bringing High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography into production and advancing the technologies that will shape its future adoption. Intel Foundry and ASML shared the following updates: High NA continues to be used in high-volume manufacturing production at Intel Foundry, with more than one million wafers processed to date across early tool certification and testing, research and development efforts, and volume production on select layers for a subset of Intel Core Ultra Series 3 processors, code-named Panther Lake. Overlay, throughput and availability are meeting Intel Foundry's expectations. Products manufactured on Intel 18A using High NA for select layers continue to deliver performance that meets or exceeds comparable layers patterned using the NXE platform (EUV with numerical aperture of 0.33). Customers can realize the benefits of High NA using the industry's current mask format, either by floor-planning within the 6-inch mask or by utilizing Intel Foundry’s stitching capabilities and process design kit (PDK) solutions. For more than three years, Intel Foundry has championed the large mask format initiative to align the mask ecosystem, working closely with ASML, mask makers, automation suppliers, EDA partners, materials providers, and semiconductor manufacturers to advance the standards, infrastructure, and technology needed to support future High NA scaling. Intel Foundry and ASML are building on years of collaboration to bring together the lithography ecosystem around larger-format masks, helping drive standards, infrastructure, and technology advances needed to support future High NA EUV scaling. Working alongside mask makers, automation suppliers, EDA partners, materials providers, and semiconductor manufacturers, the companies have helped establish the industry's path to larger-format masks while enabling customers to realize the benefits of High NA EUV.
Strategic Alliances · Business Wire
Mistral AI SAS announced that it has raised €3 billion in a round of funding co-led by new investors Samsung Electronics Co., Ltd., Scaleup Europe Fund, a fund managed by EQT AB (publ), and existing investor PSG Equity L.L.C. on September 8, 2026. The transaction included participation from new investors Advent International, L.P., funds and accounts managed by BlackRock, Inc., The Government Of The Grand Duchy Of Luxembourg, existing investors Andreessen Horowitz LLC, ASML Holding N.V., Belfius Bank SA/NV, BNP Paribas Corporate & Investment Banking, Bpifrance Investissement SAS, Carmignac Gestion SA, DST Global, Eurazeo SE, General Catalyst Group Management, LLC, Headline, Hillspire LLC, Index Ventures SA, Korelya Capital SAS, Lightspeed Management Company, LLC, NVIDIA Corporation, Solar, a fund managed by Localglobe LLP, and Salesforce Ventures, LLC. The company has issued Convertible Preferred Stock in the transaction. The transaction has been raised at a post money valuation of above €21 billion.
Private Placements · Capital IQ Transaction Database
Competitors
12 events
Applied Materials, Inc. announced that KIOXIA Corporation will join Applied’s EPIC Center in Silicon Valley as an innovation partner to advance next-generation memory technologies. The companies will work together at the EPIC Center on advanced memory-cell and structure creation, multi-chip stacking architectures, and new materials engineering approaches designed to increase memory density and performance for the AI era. Through the EPIC Center partnership, Applied Materials and KIOXIA will collaborate on R&D initiatives focused on the most critical challenges in next-generation memory innovation. Areas of focus include: Advanced memory cell and structure creation to develop more capable, higher-density memory architectures for AI applications. Multi-chip stacking for next-generation memory to enable chip integration that increases memory density and performance within constrained form factors. Advanced packaging for stacked memory to improve integration and interconnect performance in complex multi-die memory solutions. Materials engineering innovations that enable next-generation memory structures while supporting manufacturability at scale. Applied’s $5 billion* EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley represents the largest-ever U.S. investment in advanced semiconductor equipment R&D. The center, which will be operationally ready this year, is designed from the ground up to dramatically reduce the time it takes to commercialize breakthrough technologies from early-stage research to full-scale manufacturing. For chipmakers, the EPIC Center will provide earlier access to Applied’s R&D portfolio, faster cycles of learning and accelerated transfer of next-generation technologies into high-volume manufacturing, within a secure collaborative environment. In addition, the co-innovation programs at the EPIC Center will provide Applied with greater multi-node visibility to guide R&D investments while increasing R&D productivity and value sharing. *Capital spending is expected to scale over time to approximately $5 billion as customer projects commence.
Strategic Alliances · GlobeNewswire
Applied Materials will invest $5 billion in India over the next decade as the US semiconductor equipment major looks to deepen its research and development footprint, expand its supplier ecosystem and integrate India more closely into the global semiconductor value chain. The company plans to build a 140-acre advanced semiconductor research park, increase its India-based supply-chain capacity 10X by 2035, and double its R&D workforce in the country. Union Electronics and Information Technology Minister Ashwini Vaishnaw welcomed the announcement, pointing to its potential impact on jobs. Applied Materials currently employs more than 7,000 people in India, according to Raja, with its workforce in the country having grown more than fourfold over the past decade. Building a semiconductor research hub; A key part of India Vision 2035 is the proposed 140-acre advanced semiconductor research park, which will bring together cleanroom capabilities, engineering expertise and collaborative research with customers and suppliers. The project will build on Applied Materials' existing semiconductor engineering infrastructure in India. India supply chain to grow 10X; Applied Materials also plans a significant expansion of its supplier ecosystem in the country. By 2035, the company aims to grow its India-based supply-chain capacity tenfold, creating opportunities for domestic suppliers while encouraging global suppliers to expand their presence in India. Traditional sequential development is too slow and no single company can solve the challenge alone, he added. Equipment makers, chip companies, suppliers and universities will need to work more closely to accelerate the transition from research to high-volume manufacturing.
Business Expansions · Company Website
Canon has announced the EOS R8 Mark II camera, delivering full-frame results in a compact, lightweight body. The EOS R8 Mark II stands out among the crowd, delivering full frame results in a compact, lightweight camera body. This time however, it's received a bit of a face lift. Users of the first R8 will immediately feel at home with a variety of returning features, though the R8 II isn't without its updates. Most notably will be the physical design of the camera, which has a much more angular design when compared to the smooth, rounded shapes of previous Canon models. This also comes with fewer visible controls, at least atop the camera. The mode dial, power switch, record button, and M-Fn function button all sit in familiar spots, though the video mode switch is noticeably absent from the right side of the EVF housing. Minimalism may be the goal, but that doesn't come at a cost to functionality. Canon has finally added the highly sought after multi-controller joystick to the back of the camera, which can be used to maneuver autofocus points as well as navigate the menus. Additionally, the AF on button has been moved over, putting it in a more comfortable position. The R8 Mark II comes equipped with a 24.2-Megapixel Full Frame CMOS sensor, the same one found in the R8 and R6 Mark II cameras. This decision comes as no surprise, as this sensor delivers excellent quality across lighting conditions, and delivered superb color accuracy, especially for skin tones, one of Canon's longtime strengths. Behind the sensor is where things get interesting, as Canon has added in-body stabilization with 7.5 stops of compensation at the center and 7 at the periphery. This allows users to shoot confidently in a wider range of lighting conditions without worrying about shutter speeds and fast apertures, although they do help. Autofocus sees a notable improvement, with the R8 Mark II adopting many of the upgrades found in newer models. Animal and vehicle detection are present, with animal mode being specially developed for pets, birds, and horses, and the vehicle detection designed around motorsports, trains, and airplanes. The people detection feature can prioritize the subjects head, upper torso, and eyes with left or right-side priority or automatic selection of the eye closest to the camera. Alongside the 24.2-megapixel sensor, many of the R8's best features return. The EOS R8 Mark II is capable of shooting continuously at 40 fps when using the electronic shutter. This is perfect for nailing birds in flight, fast paced sports, or even the odd hair flip here and there. Note that this is not a stacked or partially stacked sensor, so rolling shutter distortion may occur when panning. Keeper rates have been improved with larger overall buffers when shooting at these fast frame rates. If recording in JPEG format, the R8 Mark II sees a 58% increase in buffer performance, allowing users to shoot up to 190 shots. RAW shooters gain a 30% increase from the first R8 and are now able to shoot up to 73 shots continuously in the Mark II. The EOS R8 Mark II offers 16 color filters to apply creative visual storytelling to both stills and videos. Additionally, the camera features a Positive and Negative Filmtone to recreate the brilliant, nostalgic aesthetic of classic analog film directly in camera. Alongside these creative filters are 14 SCN presets tailored for night scenes, smooth skin portraits, and beyond. Content creators too have much to look forward to, with the return of vertical movie mode alongside 4K60p 10-bit internal video and Canon Log 3 recording. Movie mode Image Stabilization also makes a comeback, and with a built-in microphone and headphone jack, users have an all-in-one rig ready for anything they throw at it. Advanced color grading is now possible with the Custom Picture Mode, which provides the aforementioned Canon Log 3 with up to 14 stops of dynamic range, HDR video options such as PQ and HLG, alongside two 709 options. For added detail or to slow things down in post, the camera is also able to record Full HD at up to 180p. The EOS R8 Mark II also features a slow and fast mode, to easily capture slow motion or fast motion timelapses in camera. Available alongside the EOS R8 Mark II will be a new optional EG-E2 Extension grip that significantly improves handling for those with bigger hands, or those seeking more control and comfort when working with larger lenses. This grip, much like its predecessor, features a built-in tripod socket, so there's little to no impact to overall functionality. The R8 Mark II camera features built-in Wi-Fi and Bluetooth connectivity, meaning it can pair with smart devices seamlessly for control or image sharing via Canon's app. The Canon R8 Mark II is the perfect choice for those looking to shoot on the go. It's small, lightweight, and delivers exceptional, professional results in an unassuming package. The camera will be available as the body alone, or in a kit paired with the RF 24-50mm f/4.5-6.3 IS STM.
Product-Related Announcements · PR Newswire
KLA Corporation Presents at Goldman Sachs Communacopia + Technology Conference 2026, Sep-11-2026 09:30 AM. Venue: The Palace Hotel, California, United States.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire, Other, PR Newswire, SEDAR
Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.53 per share payable on the company’s common stock. The dividend is payable on December 10, 2026 to shareholders of record as of November 19, 2026.
Dividend Affirmations · GlobeNewswire
Kopin Corporation Presents at Gabelli Funds’ 32nd Aerospace & Defense Symposium, Sep-10-2026 12:00 PM. Venue: New York, New York, United States. Speakers: Erich Manz, Treasurer & CFO, Michael Murray, CEO, President & Chairman.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire
Applied Materials, Inc. Presents at Goldman Sachs Communacopia + Technology Conference 2026, Sep-09-2026 02:25 PM. Venue: The Palace Hotel, California, United States. Speakers: Gary E. Dickerson, President, CEO & Executive Director.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire, Other, PR Newswire, SEDAR
KLA Corporation Presents at Citi’s 2026 Global TMT Conference, Sep-09-2026 09:30 AM. Venue: New York Hilton Midtown, New York, New York, United States.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire, PR Newswire, SEDAR
Applied Materials, Inc. Presents at Citi’s 2026 Global TMT Conference, Sep-08-2026 08:50 AM. Venue: New York Hilton Midtown, New York, New York, United States. Speakers: Brice A. Hill, Senior VP, CFO & leads Global Information Services.
Company Conference Presentations · Business Wire, Company Website, GlobeNewswire, PR Newswire, SEDAR
Kopin Corporation announced it has received a USD 2.4 million order from a leading international thermal weapon sight manufacturer for its advanced OLED microdisplay technology. The displays will be integrated into a next-generation thermal weapon sight program, enhancing situational awareness and operational performance for end users. Deliveries are scheduled to begin in the Fourth Quarter 2026 over a six-month fulfillment period. Kopin anticipates follow-on orders as the customer advances through additional phases of its program.
Client Announcements · Business Wire
From July 1, 2026 to September 4, 2026, the company has repurchased 5,977,300 shares, representing 0.7% for ¥25,646.99 million. With this, the company has completed the repurchase of 45,331,900 shares, representing 5.22% for ¥199,999.72 million under the buyback announced on January 29, 2026.
Buyback Tranche Update · Capital IQ Buybacks Database
The company closed its plan on September 4, 2026.
Buyback Transaction Closings · Capital IQ Buybacks Database
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